Samsung’s upcoming Galaxy S26 series has undergone significant internal changes, according to multiple reports outlining two major strategic decisions. First, Samsung has axed the Edge model and reintroduced the familiar Plus variant for this generation. Second, early rumors suggested a major shift toward Samsung’s in-house silicon — with claims that the new Exynos 2600 processor would power all three models, including the Galaxy S26 Ultra.
However, those mid-October rumors may have overstated Samsung’s confidence in its chip production. A recent ETNews report indicates that the Exynos 2600 will be used only in the standard Galaxy S26 and S26 Plus, while the S26 Ultra will rely exclusively on Qualcomm’s Snapdragon 8 Elite Gen 5 chip.
Snapdragon Takes the Lead
The new Snapdragon processor will power about 70% of all Galaxy S26 units globally, with the Exynos 2600 covering the remaining 30%. All North American models will use Snapdragon hardware, while regions including Europe, Korea, and select other markets will receive Exynos-powered versions of the base and Plus models.
Despite ongoing competition between Samsung’s semiconductor division and Qualcomm, Samsung reportedly chose the Snapdragon chip for its Ultra variant to ensure consistent supply for its best-selling flagship. The Ultra line alone generates roughly half of all Galaxy S sales, and Samsung is targeting 35 million Galaxy S26 units next year — a figure that could drive the company’s mobile revenue to decade-high levels.
Production Challenges for the Exynos 2600
While development of the Exynos 2600 was hailed as a technological success, manufacturing hurdles seem to have held the chip back from wider deployment. Industry sources cited by ETNews suggest that yield rates have not been high enough to equip all three S26 models.
The Exynos 2600 is Samsung’s first processor built on a 2nm process node — a milestone that brings both performance advantages and production risks. Earlier concerns centered on potential overheating, but the introduction of Samsung’s new Heat Pass Block (HPB) packaging appears to have mitigated those issues. The HPB module acts as a thermal dissipation layer above the chip, improving cooling and stability during intensive tasks such as AI processing.
Looking Ahead to February’s Unpacked Event
Samsung skipped the Exynos 2500 in the Galaxy S25 lineup due to thermal issues, making the Exynos 2600’s debut a critical comeback for the company’s chip division. The upcoming Galaxy Unpacked event, reportedly set for February 25 in San Francisco, will highlight both hardware and new Galaxy AI features co-developed with Google.
Beyond its role in the Galaxy S26, the Exynos 2600 represents a pivotal step for Samsung’s foundry ambitions. Success with this 2nm chip could help Samsung secure external clients — potentially even from major tech firms like Tesla. Benchmark leaks suggest the chip performs close to Apple’s new M5 processor in early tests, though real-world performance will be the ultimate proof of its promise.
